Hitachi Chemical launched mass production of “MCL-HS200,” an advanced functional laminate material for printed wiring boards, with low transmission loss and low warpage properties required for semiconductor packaging substrates used in such fields as fifth-generation mobile communications systems (5G), advanced driver-assistance systems (ADAS), and artificial intelligence (AI) in March. With technological innovations like the Internet of Things (IoT) for electronics-related products, ADAS, and AI making strides in recent years, 5G networks providing high speed, high capacity, low latency, and multiple connections have become indispensable for the widespread use of these technologies.

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